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الماركة:  SIZZIX

نموذج:  SIZ660513

Sizzix Die Brush & Foam Pad for Wafer Thin Dies

Easy Payment Plan
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التحقق من التوفّر في المتجر
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

Die Brush: 5 1/2" x 1 3/4" x 1/4"
Foam Pad: 4 1/2" x 7 1/4"
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اكسب 0 من نقاط الولاء التي تعادل BHD 0 عند تسجيل الدخول وتقديم الطلب
Easy Payment Plan
خطط الدفع السهلة
مزيد من المعلومات
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

Die Brush: 5 1/2" x 1 3/4" x 1/4"
Foam Pad: 4 1/2" x 7 1/4"
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العملاء